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Computer organization and architecture practice test MCQ: no of good dies/wafer are called with options top line, bottom line, double line and multiple line with online tutorial questions for online placement tests with past papers' important questions. Free study guide is for online learning cost trends and analysis quiz questions with MCQs to practice test questions with answers.

MCQ: No of good dies/wafer are called

1. Top line
2. Bottom line
3. Double line
4. Multiple line

B

MCQ: No of dies/300 mm or (30 cm)wafer for die which is 1.5 cm on a side and for that die which is 1.0 cm on a side, would be

1. 370 & 640
2. 270 & 740
3. 270 & 750
4. 270 & 640

D

MCQ: Dies which are 1.5cm on a side and 1.0cm on a side, supposing a density of 0.031/per cm^2 and N is 13.5, will have die yielding

1. 0.4 and 0.66
2. 0.4 and 1.66
3. 1.4 and 0.66
4. 2.4 and 0.66

A

MCQ: A wafer is normally tested and is chopped into

1. Dies
2. Tri
3. Tabs
4. Tracks

A

MCQ: Cost of die can be calculated as

1. Cost of die= Cost of wafer\ Dies per wafer + Die yield
2. Cost of die= Cost of wafer\ Dies per wafer - Die yield
3. Cost of die= Cost of wafer\ Dies per wafer ? Die yield
4. Cost of die= Cost of wafer\ Dies per wafer \ Die yield

C