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"The no of good dies/wafer are called" Multiple Choice Questions (MCQ) on cost trends and analysis with choices top line, bottom line, double line, and multiple line for computer software engineer. Practice merit scholarships assessment test, online learning cost trends and analysis quiz questions for competitive exams in computer science major to learn online certificate courses.

MCQ: The no of good dies/wafer are called

1. Top line
2. Bottom line
3. Double line
4. Multiple line

B

MCQ: The no of dies/300 mm or (30 cm)wafer for die which is 1.5 cm on a side and for that die which is 1.0 cm on a side, would be

1. 370 & 640
2. 270 & 740
3. 270 & 750
4. 270 & 640

D

MCQ: Dies which are 1.5cm on a side and 1.0cm on a side, supposing a density of 0.031/per cm^2 and N is 13.5, will have die yielding

1. 0.4 and 0.66
2. 0.4 and 1.66
3. 1.4 and 0.66
4. 2.4 and 0.66

A

MCQ: A wafer is normally tested and is chopped into

1. Dies
2. Tri
3. Tabs
4. Tracks

A

MCQ: The cost of the die can be calculated as

1. Cost of die= Cost of wafer\ Dies per wafer + Die yield
2. Cost of die= Cost of wafer\ Dies per wafer - Die yield
3. Cost of die= Cost of wafer\ Dies per wafer ? Die yield
4. Cost of die= Cost of wafer\ Dies per wafer \ Die yield

C